- ma 24 mei 2027, 09:00 – 18:00
ICMLAI-2027 is the fourth edition of the international scientific conference on machine learning, artificial intelligence, and data science, organized by Pages Conferences in Berlin, Germany. The two-day event brings together researchers, scientists, industry experts, and students for keynotes, plenary sessions, poster presentations, and extensive networking opportunities across more than 28 scientific tracks.
From Edinburgh to Amsterdam to Madrid to Berlin
ICMLAI builds on three successful previous editions: ICMLAI-2024 in Edinburgh, ICMLAI-2025 in Amsterdam, and ICMLAI-2026 in Madrid. Pages Conferences organizes the series as a platform for knowledge exchange and collaboration between academics, industry, and technology leaders worldwide. Berlin, with its thriving startup ecosystem, strong industry-academic collaboration, and excellent international accessibility, provides the ideal setting for the fourth edition.
Speakers from global institutions
Confirmed plenary speakers are Prof. Dr. Peter G. Gyarmati (Stanford University, USA), Dr. Valerio Frascolla (Director Research and Innovation, Intel, Germany), Dr. Cameron Ikin (Capricorne Spatial Agence, Australia), and Dr. Payam Tamizi (University of Cote d’Azur, France). Keynote speakers come from the University of Opole, the University of Greenwich, Capitol Technology University, and Valdosta State University. Invited speakers are active at AJ Gallagher, the Hindustan Institute of Technology & Science, and Ladoke Akintola University of Technology, among others.
28 scientific tracks
The program covers a broad spectrum: machine learning and AI, deep learning and neural networks, NLP and speech technology, image and video recognition, reinforcement learning and multi-agent systems, explainable AI and ethics, precision medicine and AI in healthcare, edge AI and TinyML, federated learning and privacy-preserving AI, cybersecurity and cyber intelligence, AI for climate science and sustainability, human-AI collaboration, generative AI for science and engineering, and more.